Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration
Overview
The "Lab to Fab Accelerators for Advanced Packaging and Heterogeneous Integration" grant opportunity, identified as DIGITAL-JU-Chips-2025-SG-LFA, is part of the Digital Europe Programme aimed at enhancing the European semiconductor industry. The call is specifically targeted at promoting projects that facilitate the transition of advanced packaging technologies from research and pilot studies to full-scale industrial applications.
The opportunity opens for applications on December 3, 2025, and will remain open until February 25, 2026. The total budget for this initiative is €50 million, with an expected five grants to be awarded. Each project can receive funding ranging from a minimum of €500,000 to a maximum of €15 million. The grants are classified as DIGITAL JU Simple Grants utilizing a DIGITAL Action Grant Budget-Based model, designed to provide direct financial support for executing approved proposals.
Eligible applicants include a diverse range of entities within the semiconductor ecosystem, such as research and technology organizations, universities, small and medium-sized enterprises, large enterprises, and semiconductor packaging companies. The emphasis is on encouraging consortium applications that bring together various stakeholders across the semiconductor value chain, including materials suppliers, substrate providers, equipment manufacturers, and end-use customers.
The funding opportunity targets sectors involved in advanced semiconductor packaging and heterogeneous integration, contributing to strengthening the European digital economy and technological capacity. Projects should aim for technology transfer from pilot lines to commercial execution, ideally operating at Technology Readiness Levels 5 to 7, which encompasses development, demonstration, and early commercialization stages.
The application process is streamlined into a single submission stage, with submissions requested electronically through the EU Funding & Tenders Portal. While the document does not provide specific success rate statistics, previous similar calls have noted success rates ranging between 10 to 39%, suggesting a competitive environment for these grants. Co-funding is not required, but projects are expected to demonstrate financial contributions potentially matching up to 50% of eligible project costs from other sources.
Overall, this grant opportunity represents a strategic European effort to bolster semiconductor manufacturing capabilities, fostering innovation and developing a robust supply chain in advanced packaging technologies, essential for maintaining competitiveness in the global market.
The opportunity opens for applications on December 3, 2025, and will remain open until February 25, 2026. The total budget for this initiative is €50 million, with an expected five grants to be awarded. Each project can receive funding ranging from a minimum of €500,000 to a maximum of €15 million. The grants are classified as DIGITAL JU Simple Grants utilizing a DIGITAL Action Grant Budget-Based model, designed to provide direct financial support for executing approved proposals.
Eligible applicants include a diverse range of entities within the semiconductor ecosystem, such as research and technology organizations, universities, small and medium-sized enterprises, large enterprises, and semiconductor packaging companies. The emphasis is on encouraging consortium applications that bring together various stakeholders across the semiconductor value chain, including materials suppliers, substrate providers, equipment manufacturers, and end-use customers.
The funding opportunity targets sectors involved in advanced semiconductor packaging and heterogeneous integration, contributing to strengthening the European digital economy and technological capacity. Projects should aim for technology transfer from pilot lines to commercial execution, ideally operating at Technology Readiness Levels 5 to 7, which encompasses development, demonstration, and early commercialization stages.
The application process is streamlined into a single submission stage, with submissions requested electronically through the EU Funding & Tenders Portal. While the document does not provide specific success rate statistics, previous similar calls have noted success rates ranging between 10 to 39%, suggesting a competitive environment for these grants. Co-funding is not required, but projects are expected to demonstrate financial contributions potentially matching up to 50% of eligible project costs from other sources.
Overall, this grant opportunity represents a strategic European effort to bolster semiconductor manufacturing capabilities, fostering innovation and developing a robust supply chain in advanced packaging technologies, essential for maintaining competitiveness in the global market.
Detail
The DIGITAL-JU-Chips-2025-SG-LFA call, titled "Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration," is part of the Digital Europe Programme (DIGITAL). It aims to bolster the European semiconductor industry by fostering innovation and accelerating the industrial deployment of advanced packaging technologies. This is a DIGITAL JU Simple Grant, utilizing a DIGITAL Action Grant Budget-Based [DIGITAL-AG] model. The call opened on December 3, 2025, and has a submission deadline of February 25, 2026, at 17:00:00 Brussels time.
The expected outcome of this call is to create new opportunities for European semiconductor packaging companies and their supply chains. This will be achieved by leveraging the services of Research and Technology Organizations (RTOs) and the Chips Joint Undertaking (JU) pilot lines. The Lab to Fab Accelerator (LFA) projects are designed to prepare and expedite the transfer of technologies from these pilot lines to full-scale industrial deployment.
The call also aims to expand the advanced packaging ecosystem within Europe, enhancing its competitiveness through the rapid industrialization of European semiconductor technology. Projects should involve relevant stakeholders across the value chain, including materials, substrate, equipment, and test providers, as well as packaging companies and their European customers. The goal is to establish a robust European innovation and transfer ecosystem for advanced packaging solutions, thereby contributing to the creation of new and resilient supply chains within Europe.
The total budget allocated to this topic is 50,000,000 EUR for the year 2025. The call is a single-stage process, and the expected contribution per project ranges from 500,000 to 15,000,000 EUR. The indicative number of grants to be awarded is 5.
Conditions for application include:
1. Admissibility Conditions: The proposal page limit and layout must adhere to the guidelines detailed in Part B of the Application Form, which can be found in the Call Documents section of the Chips JU website. Appendix 6.v6 of the Chips JU Work Programme provides further details.
2. Eligible Countries: Specific information on eligible countries is available but not detailed in the provided text.
3. Other Eligible Conditions: Details on other eligibility conditions are not specified in the provided text.
4. Financial and operational capacity and exclusion: Applicants must meet the necessary financial and operational capacity requirements, and must not be subject to any exclusion criteria.
5a. Evaluation and award: The submission and evaluation processes will be conducted according to established guidelines.
5b. Evaluation and award: Award criteria, scoring, and thresholds will be used to assess the proposals.
5c. Evaluation and award: An indicative timeline for the evaluation process and grant agreement will be provided.
6. Legal and financial set-up of the grants: The legal and financial framework for the grants will be in accordance with EU regulations.
Applicants are advised to visit the Call page of the Chips JU Website for comprehensive information.
The Call Documents Section contains all necessary documents, including:
Reference documents:
Guide for Applicants
Evaluation form
Call submission documents and annexes:
Application form template Part B
National Budget table
Ownership declaration template
Model Grant Agreements (MGA):
DEP MGA
Additional documents:
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
The Funding & Tenders Portal provides access to the Electronic Submission Service. Applicants must select the appropriate type of action and model grant agreement. Existing draft proposals can be accessed via the Funding & Tenders Portal.
For assistance, applicants can contact calls@chips-ju.europa.eu for call-related inquiries or the IT Helpdesk for technical issues. The Online Manual offers a step-by-step guide through the Portal processes.
This funding opportunity, DIGITAL-JU-Chips-2025-SG-LFA, is designed to stimulate the European semiconductor industry, specifically in the area of advanced packaging and heterogeneous integration. It aims to bridge the gap between research and industrial application by supporting projects that transfer technologies from pilot lines to commercial deployment. By encouraging collaboration among various actors in the semiconductor value chain, the call seeks to create a resilient and competitive European ecosystem for semiconductor packaging. The funding supports projects that can demonstrate a clear path to industrialization, contributing to the overall strengthening of Europe's position in the global semiconductor market. The call is structured as a single-stage application process with a substantial budget, indicating the EU's commitment to advancing semiconductor technology within Europe.
The expected outcome of this call is to create new opportunities for European semiconductor packaging companies and their supply chains. This will be achieved by leveraging the services of Research and Technology Organizations (RTOs) and the Chips Joint Undertaking (JU) pilot lines. The Lab to Fab Accelerator (LFA) projects are designed to prepare and expedite the transfer of technologies from these pilot lines to full-scale industrial deployment.
The call also aims to expand the advanced packaging ecosystem within Europe, enhancing its competitiveness through the rapid industrialization of European semiconductor technology. Projects should involve relevant stakeholders across the value chain, including materials, substrate, equipment, and test providers, as well as packaging companies and their European customers. The goal is to establish a robust European innovation and transfer ecosystem for advanced packaging solutions, thereby contributing to the creation of new and resilient supply chains within Europe.
The total budget allocated to this topic is 50,000,000 EUR for the year 2025. The call is a single-stage process, and the expected contribution per project ranges from 500,000 to 15,000,000 EUR. The indicative number of grants to be awarded is 5.
Conditions for application include:
1. Admissibility Conditions: The proposal page limit and layout must adhere to the guidelines detailed in Part B of the Application Form, which can be found in the Call Documents section of the Chips JU website. Appendix 6.v6 of the Chips JU Work Programme provides further details.
2. Eligible Countries: Specific information on eligible countries is available but not detailed in the provided text.
3. Other Eligible Conditions: Details on other eligibility conditions are not specified in the provided text.
4. Financial and operational capacity and exclusion: Applicants must meet the necessary financial and operational capacity requirements, and must not be subject to any exclusion criteria.
5a. Evaluation and award: The submission and evaluation processes will be conducted according to established guidelines.
5b. Evaluation and award: Award criteria, scoring, and thresholds will be used to assess the proposals.
5c. Evaluation and award: An indicative timeline for the evaluation process and grant agreement will be provided.
6. Legal and financial set-up of the grants: The legal and financial framework for the grants will be in accordance with EU regulations.
Applicants are advised to visit the Call page of the Chips JU Website for comprehensive information.
The Call Documents Section contains all necessary documents, including:
Reference documents:
Guide for Applicants
Evaluation form
Call submission documents and annexes:
Application form template Part B
National Budget table
Ownership declaration template
Model Grant Agreements (MGA):
DEP MGA
Additional documents:
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
The Funding & Tenders Portal provides access to the Electronic Submission Service. Applicants must select the appropriate type of action and model grant agreement. Existing draft proposals can be accessed via the Funding & Tenders Portal.
For assistance, applicants can contact calls@chips-ju.europa.eu for call-related inquiries or the IT Helpdesk for technical issues. The Online Manual offers a step-by-step guide through the Portal processes.
This funding opportunity, DIGITAL-JU-Chips-2025-SG-LFA, is designed to stimulate the European semiconductor industry, specifically in the area of advanced packaging and heterogeneous integration. It aims to bridge the gap between research and industrial application by supporting projects that transfer technologies from pilot lines to commercial deployment. By encouraging collaboration among various actors in the semiconductor value chain, the call seeks to create a resilient and competitive European ecosystem for semiconductor packaging. The funding supports projects that can demonstrate a clear path to industrialization, contributing to the overall strengthening of Europe's position in the global semiconductor market. The call is structured as a single-stage application process with a substantial budget, indicating the EU's commitment to advancing semiconductor technology within Europe.
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Breakdown
Eligible Applicant Types: The eligible applicant types are not explicitly stated, but the description suggests that the following types of entities are likely eligible: semiconductor packaging companies, research and technology organizations (RTOs), materials providers, substrate providers, equipment providers, test providers, and European customers of packaging companies. The call emphasizes the involvement of actors across the value chain.
Funding Type: The funding type is a grant, specifically a DIGITAL JU Simple Grant, as indicated by "DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants" and "DIGITAL Action Grant Budget-Based [DIGITAL-AG]".
Consortium Requirement: The call encourages the involvement of appropriate actors across the value chain, suggesting that a consortium is preferred, although it is not explicitly stated whether a single applicant is disallowed. The emphasis on building a strong European innovation and transfer ecosystem points towards a consortium approach.
Beneficiary Scope (Geographic Eligibility): The call is targeted towards European-based entities, as it aims to open up new opportunities for "European-based semiconductor packaging companies" and expand the "advanced packaging ecosystem in Europe".
Target Sector: The target sector is semiconductors, specifically advanced packaging and heterogeneous integration within the semiconductor industry. This includes materials, substrates, equipment, and testing related to semiconductor packaging.
Mentioned Countries: The opportunity focuses on Europe, so the EU and its member states are implied.
Project Stage: The project stage is focused on the transfer of technologies from pilot lines to industrial deployment, indicating a stage between demonstration and commercialization. The LFA projects should prepare and speed up this transfer.
Funding Amount: The funding range is between 500,000 EUR and 15,000,000 EUR. The total budget for the topic is 50,000,000 EUR, and the indicative number of grants is 5.
Application Type: The application type is an open call, as indicated by "Open For Submission".
Nature of Support: Beneficiaries will receive money in the form of a grant.
Application Stages: The application process is a single-stage process.
Success Rates: The success rate cannot be determined from the provided text. The text mentions that there are 5 indicative grants and a 50,000,000 EUR budget.
Co-funding Requirement: The text does not explicitly mention a co-funding requirement.
Summary:
This opportunity, titled "Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration (DIGITAL-JU-CHIPS-2025-SG-LFA)", is a call for proposals under the Digital Europe Programme (DIGITAL). It aims to bolster the European semiconductor industry by supporting projects that accelerate the transfer of advanced packaging technologies from pilot lines to industrial deployment. The call is specifically targeted at European-based semiconductor packaging companies and their supply chains, including materials, substrate, equipment, and test providers, as well as their European customers. The goal is to expand the advanced packaging ecosystem in Europe, enhance its competitiveness, and build resilient supply chains. The funding mechanism is a DIGITAL JU Simple Grant, with individual grants ranging from 500,000 EUR to 15,000,000 EUR. The total budget allocated for this topic is 50,000,000 EUR, with an expected number of 5 grants to be awarded. The application process is a single-stage submission, with the opening date for submissions being December 3, 2025, and the deadline for submissions being February 25, 2026. Applicants are expected to form consortia involving various actors across the semiconductor packaging value chain to foster a strong European innovation and transfer ecosystem. The call emphasizes the importance of industrializing European semiconductor technology and creating new opportunities for European companies in this sector.
Funding Type: The funding type is a grant, specifically a DIGITAL JU Simple Grant, as indicated by "DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants" and "DIGITAL Action Grant Budget-Based [DIGITAL-AG]".
Consortium Requirement: The call encourages the involvement of appropriate actors across the value chain, suggesting that a consortium is preferred, although it is not explicitly stated whether a single applicant is disallowed. The emphasis on building a strong European innovation and transfer ecosystem points towards a consortium approach.
Beneficiary Scope (Geographic Eligibility): The call is targeted towards European-based entities, as it aims to open up new opportunities for "European-based semiconductor packaging companies" and expand the "advanced packaging ecosystem in Europe".
Target Sector: The target sector is semiconductors, specifically advanced packaging and heterogeneous integration within the semiconductor industry. This includes materials, substrates, equipment, and testing related to semiconductor packaging.
Mentioned Countries: The opportunity focuses on Europe, so the EU and its member states are implied.
Project Stage: The project stage is focused on the transfer of technologies from pilot lines to industrial deployment, indicating a stage between demonstration and commercialization. The LFA projects should prepare and speed up this transfer.
Funding Amount: The funding range is between 500,000 EUR and 15,000,000 EUR. The total budget for the topic is 50,000,000 EUR, and the indicative number of grants is 5.
Application Type: The application type is an open call, as indicated by "Open For Submission".
Nature of Support: Beneficiaries will receive money in the form of a grant.
Application Stages: The application process is a single-stage process.
Success Rates: The success rate cannot be determined from the provided text. The text mentions that there are 5 indicative grants and a 50,000,000 EUR budget.
Co-funding Requirement: The text does not explicitly mention a co-funding requirement.
Summary:
This opportunity, titled "Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration (DIGITAL-JU-CHIPS-2025-SG-LFA)", is a call for proposals under the Digital Europe Programme (DIGITAL). It aims to bolster the European semiconductor industry by supporting projects that accelerate the transfer of advanced packaging technologies from pilot lines to industrial deployment. The call is specifically targeted at European-based semiconductor packaging companies and their supply chains, including materials, substrate, equipment, and test providers, as well as their European customers. The goal is to expand the advanced packaging ecosystem in Europe, enhance its competitiveness, and build resilient supply chains. The funding mechanism is a DIGITAL JU Simple Grant, with individual grants ranging from 500,000 EUR to 15,000,000 EUR. The total budget allocated for this topic is 50,000,000 EUR, with an expected number of 5 grants to be awarded. The application process is a single-stage submission, with the opening date for submissions being December 3, 2025, and the deadline for submissions being February 25, 2026. Applicants are expected to form consortia involving various actors across the semiconductor packaging value chain to foster a strong European innovation and transfer ecosystem. The call emphasizes the importance of industrializing European semiconductor technology and creating new opportunities for European companies in this sector.
Short Summary
Impact This funding aims to accelerate the industrial deployment of advanced semiconductor packaging technologies and enhance Europe's competitiveness in the semiconductor sector. | Impact | This funding aims to accelerate the industrial deployment of advanced semiconductor packaging technologies and enhance Europe's competitiveness in the semiconductor sector. |
Applicant Applicants should possess expertise in semiconductor technology, including advanced packaging, heterogeneous integration, and related supply chain processes. | Applicant | Applicants should possess expertise in semiconductor technology, including advanced packaging, heterogeneous integration, and related supply chain processes. |
Developments The funding will support projects focused on technology transfer from research to industrial deployment in the semiconductor packaging sector. | Developments | The funding will support projects focused on technology transfer from research to industrial deployment in the semiconductor packaging sector. |
Applicant Type This funding is designed for European-based semiconductor companies, research organizations, universities, SMEs, and large enterprises involved in the semiconductor packaging value chain. | Applicant Type | This funding is designed for European-based semiconductor companies, research organizations, universities, SMEs, and large enterprises involved in the semiconductor packaging value chain. |
Consortium The funding encourages the formation of consortia involving multiple applicants across the semiconductor packaging value chain. | Consortium | The funding encourages the formation of consortia involving multiple applicants across the semiconductor packaging value chain. |
Funding Amount The total budget for this call is €50,000,000, with individual grants ranging from €500,000 to €15,000,000. | Funding Amount | The total budget for this call is €50,000,000, with individual grants ranging from €500,000 to €15,000,000. |
Countries The funding is relevant for all EU member states as it targets European-based applicants. | Countries | The funding is relevant for all EU member states as it targets European-based applicants. |
Industry This funding is part of the Digital Europe Programme, specifically targeting the semiconductor and microelectronics sector. | Industry | This funding is part of the Digital Europe Programme, specifically targeting the semiconductor and microelectronics sector. |
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