HORIZON-JU-CHIPS-2025-CSA-JPN

The HORIZON-JU-CHIPS-2025-CSA-JPN opportunity is part of the Horizon Europe framework and focuses on coordinating and supporting EU-Japan collaboration in the semiconductor sector. It is classified as a Coordination and Support Action (CSA) under the Chips Joint Undertaking. The primary goal is to enhance research and innovation (R&I) activities related to semiconductor manufacturing and to facilitate collaboration between stakeholders from the EU and Japan.

Applicants eligible for this grant may include universities, research institutes, small and medium-sized enterprises (SMEs), large enterprises, and public-private partnerships, all of which should be involved in semiconductor research and innovation. The project requires a consortium that must involve partners from both the EU and Japan, thereby enhancing cross-regional collaboration.

The funding type provided is a grant under the Horizon Action Grant Budget-Based model, with a total budget of €1,000,000 for 2025, where each project can expect funding between €500,000 and €1,000,000. The application process is a single-stage open call, requiring submissions to be made by September 17, 2025. There is no co-funding requirement, as the funding rate is typically 100% of eligible costs.

The project scope includes coordinating ongoing R&I initiatives, organizing networks, conferences, and workshops, supporting researcher exchanges, and preparing topics for future collaboration in life cycle assessment (LCA) and semiconductor supply chain security. While specific success rates are currently unknown, the expected outcome is a single grant awarded for this call.

The initiative emphasizes the importance of stakeholder engagement and networking to address both immediate and future needs in the semiconductor industry. The call is designed to foster a robust exchange of knowledge and resources between the EU and Japan, aiming to improve supply chain stability and support sustainable practices within the semiconductor manufacturing sector.

Overall, the opportunity reflects the emphasis on international collaboration in technological development, particularly in addressing challenges and advancing strategies within the semiconductor domain.

The HORIZON-JU-CHIPS-2025-CSA-JPN call, under the Horizon Europe program, aims to foster collaboration between the EU and Japan in the semiconductor industry. It falls under the HORIZON-JU-CSA (HORIZON JU Coordination and Support Actions) type of action and utilizes a HORIZON Action Grant Budget-Based [HORIZON-AG] model grant agreement. The call is currently open for submission with a single-stage deadline. The opening date was July 8, 2025, and the deadline for submissions is September 17, 2025, at 17:00:00 Brussels time.

The expected outcomes of this call are multifaceted. Firstly, it aims to coordinate ongoing Japanese and EU Research and Innovation (R&I) activities related to the Life Cycle Assessment (LCA) of semiconductor manufacturing processes, facilitating the exchange of researchers to enhance coherence. Secondly, it seeks to support joint R&I activities between the EU and Japan, contributing to the identification of potential future joint R&I collaboration topics within the semiconductor field. Thirdly, the call intends to explore opportunities for financing talent exchanges between R&D or production sites in both regions. Fourthly, it aims to foster increased cooperation with appropriate research institutions in Japan on the development, deployment, and commercialization of digital technologies, for example through specific collaboration in the field of R&I. Finally, it seeks to support joint activities of companies in the semiconductor value chain to improve security of supply for chips.

The scope of the call encompasses several key areas. It includes organizing and supporting networks, conferences, workshops, and other actions that support semiconductor joint EU-Japan R&I activities, particularly to generate R&I priorities for potential future collaboration, and connect EU and Japanese companies in the semiconductor value chain to exchange information and propose measures to improve chip supply chain stability. It also supports the exchange of researchers and closer coordination of running R&I activities in both regions which address equal or similar objectivities, for instance on the development of a reference database for Life Cycle Assessment or Green House Gas emission in semiconductor manufacturing processes. Furthermore, it aims to increase networking and collaboration of stakeholders from the EU and Japan with a view to addressing current needs, considering future requirements and stimulating long-term cooperation. The action should ensure that relevant stakeholders from both the EU and Japan are engaged during the process through regional and international workshops and a set of communication and dissemination actions.

Regarding the conditions and documents, the admissibility conditions related to proposal page limits and layout are described in Appendix 5 of the Multi Annual Work Programme of Chips JU and Part B of the Application Form available in the Submission System. The eligible countries and other eligible conditions are also described in Appendix 5 of the Multi Annual Work Programme of Chips JU. Financial and operational capacity and exclusion criteria are detailed in Annex C of the Work Programme General Annexes. The evaluation and award criteria, scoring, and thresholds, as well as the submission and evaluation processes and the indicative timeline for evaluation and grant agreement, are described in Appendix 5 of the Multi Annual Work Programme of Chips JU. The legal and financial set-up of the grants is described in Appendix 5 of the Multi Annual Work Programme of Chips JU and in Annex G of the Work Programme General Annexes. Specific conditions are described in the Appendix 5 of the Multi Annual Work Programme of Chips JU.

The call documents include application form templates available in the Submission System, the HE Programme Guide, Model Grant Agreements (MGA) such as the HE MGA, call-specific instructions in Appendix 5 of the Multi Annual Work Programme of Chips JU, and information on financial support to third parties (HE). Additional documents include the Multi Annual Work Programme 2023-2027 Chips JU, HE Programme Guide, HE Framework Programme 2021/695, HE Specific Programme Decision 2021/764, EU Financial Regulation 2024/2509, Decision authorising the use of lump sum contributions under the Horizon Europe Programme, Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment, EU Grants AGA Annotated Model Grant Agreement, Funding & Tenders Portal Online Manual, Funding & Tenders Portal Terms and Conditions, and Funding & Tenders Portal Privacy Statement.

The budget overview indicates that the HORIZON-JU-CHIPS-2025-CSA-JPN topic has a budget of 1,000,000 EUR for the year 2025. It is a single-stage application process with an opening date of July 8, 2025, and a deadline of September 17, 2025. The expected contributions range from 500,000 to 1,000,000 EUR, and the indicative number of grants is 1.

There is a partner search function available, where LEARs, Account Administrators, and self-registrants can publish partner requests.

To submit a proposal, applicants must access the Electronic Submission Service via the Funding & Tenders Portal.

For help related to this call, applicants can contact Calls@chips-ju.europa.eu. Additional support resources include the Online Manual, Horizon Europe Programme Guide, Funding & Tenders Portal FAQ, Research Enquiry Service, National Contact Points (NCPs), Enterprise Europe Network, IT Helpdesk, European IPR Helpdesk, CEN-CENELEC Research Helpdesk, ETSI Research Helpdesk, the European Charter for Researchers, and Partner Search.

In summary, this Horizon Europe call focuses on strengthening EU-Japan collaboration in the semiconductor industry. It aims to coordinate research activities, support joint projects, facilitate talent exchange, and improve the security of the chip supply chain. The call encourages the organization of networks, conferences, and workshops, and the engagement of stakeholders from both regions. The funding available is 1,000,000 EUR, and the application process is single-stage, with a deadline in September 2025. Applicants should consult the provided documents and resources for detailed guidance on eligibility, proposal preparation, and submission.

Eligible Applicant Types: The eligible applicant types are not explicitly stated in the provided text. However, given the nature of Horizon Europe and the Chips Joint Undertaking (JU), eligible applicants are likely to include universities, research institutes, SMEs, large enterprises, and other organizations involved in research and innovation within the semiconductor value chain.

Funding Type: The funding type is a grant, specifically a HORIZON Action Grant Budget-Based [HORIZON-AG]. The call is for HORIZON JU Coordination and Support Actions (HORIZON-JU-CSA).

Consortium Requirement: The text does not explicitly state whether a consortium is required. However, the call encourages collaboration between EU and Japanese entities, suggesting that a consortium involving both European and Japanese partners would be beneficial, if not required. The partner search announcements also indicate that collaboration is expected.

Beneficiary Scope (Geographic Eligibility): The geographic eligibility includes both the EU and Japan, as the call focuses on fostering collaboration between these two regions. The text also mentions "non-EU and non-associated countries ('third-countries')", suggesting that entities from these countries might also be eligible under certain conditions.

Target Sector: The target sector is the semiconductor industry, with a focus on research and innovation (R&I), chip supply chain stability, life cycle assessment (LCA) of semiconductor manufacturing processes, and the development, deployment, and commercialization of digital technologies.

Mentioned Countries: The countries explicitly mentioned are the EU member states and Japan.

Project Stage: The project stage is focused on coordination and support actions, which implies activities related to networking, collaboration, and preparation for future R&I activities. This suggests a focus on the research, development, and validation stages, rather than commercialization or scale-up, although the call does mention supporting the commercialization of digital technologies.

Funding Amount: The budget for the topic HORIZON-JU-CHIPS-2025-CSA-JPN is EUR 1,000,000. The contributions are expected to range from EUR 500,000 to EUR 1,000,000.

Application Type: The application type is an open call with a single-stage submission process.

Nature of Support: The beneficiaries will receive money in the form of a grant to support their coordination and support actions.

Application Stages: The application process consists of a single stage.

Success Rates: The indicative number of grants is 1, but the success rate cannot be determined from the provided information.

Co-funding Requirement: The text does not explicitly mention a co-funding requirement.

Summary:

This opportunity, HORIZON-JU-CHIPS-2025-CSA-JPN, is a call for proposals under the Horizon Europe program, specifically targeting Coordination and Support Actions (CSA) within the semiconductor industry. It aims to foster collaboration between EU and Japanese entities to enhance research and innovation, improve chip supply chain stability, and promote the development and commercialization of digital technologies. The call encourages activities such as organizing networks, conferences, and workshops, supporting researcher exchanges, and coordinating R&I activities related to life cycle assessment of semiconductor manufacturing processes.

The funding is provided as a Horizon Action Grant, with a total budget of EUR 1,000,000 and expected contributions ranging from EUR 500,000 to EUR 1,000,000 per project. The application process is a single-stage open call, with a deadline of September 17, 2025.

Eligible applicants are likely to include universities, research institutes, SMEs, large enterprises, and other organizations involved in research and innovation within the semiconductor value chain, with a strong emphasis on collaboration between EU and Japanese stakeholders. The call seeks to coordinate ongoing R&I activities, prepare for future joint initiatives, and improve the overall security and sustainability of the semiconductor industry.