DIGITAL-JU-CHIPS-2025-IA-LEAI

The DIGITAL-JU-CHIPS-2025-IA-LEAI call, part of the Digital Europe Programme, aims to advance the development of next-generation edge AI chips. This grant opportunity is categorized as a DIGITAL JU Simple Grant with a budget of €20 million for the year 2025, set to provide 4 grants ranging from €1 million to €5 million each. The application period is open, starting on July 8, 2025, and closing on September 17, 2025, at 17:00 Brussels time.

Eligible entities include universities, research institutes, small and medium-sized enterprises (SMEs), and large companies capable of developing AI chip prototypes. The call explicitly encourages the formation of consortia to leverage various infrastructures and expertise within the EU. The project stage is characterized by the need to reach Technology Readiness Levels (TRL) 6-7, focusing on developing prototypes that exhibit real-world applicability and potential for industrial scaling.

Key sectors targeted by this call are semiconductors, artificial intelligence, and edge computing, with an emphasis on low-power AI chips suitable for applications in industries such as 6G mobile communication, autonomous systems, healthcare, and industrial automation. Successful proposals must integrate advanced technologies like non-volatile memories, neuromorphic computing, and 3D heterogeneous integration.

While specific countries were not mentioned, the eligibility extends across EU member states and associated countries. Grant funding is structured to cover up to 50% of total project costs, implying a requirement for co-funding.

The submission process involves a single-stage model with no pre-selection, and details about admissibility, proposal formatting, evaluation processes, and financial conditions are outlined in various call documents available on the Chips Joint Undertaking website. Overall, this initiative aims to strengthen Europe's semiconductor industry and support its digital transformation and sustainability goals.

The DIGITAL-JU-CHIPS-2025-IA-LEAI call, under the Digital Europe Programme (DIGITAL), aims to drive the development of next-generation edge AI chips. This is a DIGITAL JU Simple Grant, utilizing a DIGITAL Action Grant Budget-Based [DIGITAL-AG] Model Grant Agreement. The call is currently open for submission with a single-stage deadline model. The opening date is July 8, 2025, and the deadline for submission is September 17, 2025, at 17:00:00 Brussels time.

The expected outcome of successful proposals includes the development of AI chip prototypes reaching Technology Readiness Level (TRL) 6-7. These prototypes should integrate cutting-edge technologies such as non-volatile memories, neuromorphic computing, 3D heterogeneous integration, and photonic connectivity. Testing under real-world conditions is required to demonstrate potential for industrial scaling. Projects should leverage advanced capabilities of state-of-the-art infrastructures within the Union, especially at leading Research and Technology Organisations (RTOs), including the Testing and Experimentation Facility (TEF) for Edge AI hardware (PREVAIL project) and Pilot Lines, including those of the Chips for Europe Initiative. The prototypes should exhibit robust AI capabilities, including real-time inference, on-device learning, and adaptive decision-making, enabling edge AI systems to process data locally and adapt to changing environments without cloud reliance, thus reducing latency and power consumption. Ultra-low power consumption is a must for energy-efficient AI operations, particularly for battery-powered devices, balancing computing power with energy efficiency. The developed technologies should contribute to Europe's digital transformation and sustainability goals by advancing energy-efficient and highly secure AI chips. The ultimate goal is to enable real-time, on-chip AI capabilities for applications in mobile communication networks (e.g. 6G), autonomous systems, industrial automation, and healthcare, aligning with Europe’s sustainability and digitalization goals.

Conditions for application include: Admissibility Conditions related to proposal page limit and layout, detailed in Part B of the Application Form, accessible from the Call documents section on the Chips JU website. Information is also described in Appendix 6v4 of the Chips JU Workprogramme. Other conditions include: Eligible Countries, Other Eligible Conditions, Financial and operational capacity and exclusion, Evaluation and award processes (Submission and evaluation processes, Award criteria, scoring and thresholds, Indicative timeline for evaluation and grant agreement), and Legal and financial set-up of the grants. Applicants are advised to visit the Call page of the Chips JU Website.

The Call Documents Section contains all the call documents, including: Reference documents (Guide for Applicants, Evaluation form), Call submission documents and annexes (Application form template Part B, National funding table template, Ownership declaration template), and Model Grant Agreements (MGA) including DEP MGA. Additional documents include: DEP Regulation 2021/964, EU Financial Regulation 2024/2509, Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment, EU Grants AGA Annotated Model Grant Agreement, Funding & Tenders Portal Online Manual, Funding & Tenders Portal Terms and Conditions, and Funding & Tenders Portal Privacy Statement.

The budget for the DIGITAL-JU-CHIPS-2025-IA-LEAI topic is 20,000,000 EUR for the year 2025. The call follows a single-stage submission process. The opening date is July 8, 2025, and the deadline is September 17, 2025. The expected contribution per grant ranges from 1,000,000 to 5,000,000 EUR, and the indicative number of grants to be awarded is 4.

Partner search announcements are available for collaboration on this topic. LEARs, Account Administrators, and self-registrants can publish partner requests.

To start the submission process, applicants should access the Electronic Submission Service via the submission button, selecting the appropriate type of action and model grant agreement. Existing draft proposals can be accessed through the Funding & Tenders Portal.

For help related to this call, applicants can contact calls@chips-ju.europa.eu. Additional support resources include the Funding & Tenders Portal FAQ, IT Helpdesk, and Online Manual.

In summary, this EU grant opportunity, DIGITAL-JU-CHIPS-2025-IA-LEAI, focuses on funding projects that develop next-generation edge AI chips. The goal is to create chips that are high-performance, ultra-low power, and capable of real-time, on-chip AI. These chips should be applicable in various sectors like mobile communication, autonomous systems, industrial automation, and healthcare. The call aims to boost Europe's digital transformation and sustainability efforts. The application process involves submitting a detailed proposal, adhering to specific guidelines and deadlines, and potentially collaborating with other partners. The EU provides funding to selected projects that demonstrate the potential to advance AI chip technology and contribute to European technological leadership.

Eligible Applicant Types: The provided text does not explicitly list eligible applicant types. However, it mentions Research and Technology Organisations (RTOs), LEARs (Legal Entity Appointed Representatives), Account Administrators, and self-registrants, suggesting that research institutions, organizations with legal entities, and users with active profiles are likely eligible. Further details would be available in the call documents on the Chips JU website.

Funding Type: The funding type is a grant, specifically a "DIGITAL JU Simple Grant" and a "DIGITAL Action Grant Budget-Based [DIGITAL-AG]".

Consortium Requirement: The text does not explicitly state whether a consortium is required. However, the mention of "Partner search announcements" and the ability for LEARs and others to "publish partner requests" suggests that consortia are possible and perhaps encouraged, but it is not explicitly stated if a single applicant is also allowed.

Beneficiary Scope (Geographic Eligibility): The text mentions leveraging capabilities "within the Union," suggesting that the geographic eligibility is primarily focused on the European Union. Further details would be available in the "Eligible Countries" section of the call conditions.

Target Sector: The program targets the semiconductor industry, specifically focusing on "next-generation edge AI chips." This includes areas like AI, ICT, mobile communication networks (6G), autonomous systems, industrial automation, healthcare, sustainability, and digitalization. The technologies mentioned include non-volatile memories, neuromorphic computing, 3D heterogeneous integration, and photonic connectivity.

Mentioned Countries: No specific countries are mentioned, but the focus is on the European Union.

Project Stage: The expected project stage is between Technology Readiness Level (TRL) 6 and 7. This indicates that the projects should be at the prototype stage, tested under real-world conditions, and show potential for industrial scaling.

Funding Amount: The funding range is between €1,000,000 and €5,000,000 per grant. The total budget for the topic is €20,000,000, with an indicative number of 4 grants to be awarded.

Application Type: The application type is an open call, with a single-stage submission process. The submission session opens on 08 July 2025, and the deadline for submission is 17 September 2025 at 17:00:00 Brussels time.

Nature of Support: The beneficiaries will receive money in the form of a grant.

Application Stages: The application process is single-stage.

Success Rates: The success rate cannot be determined from the provided text. The indicative number of grants (4) and the total budget (€20,000,000) suggest that the competition may be significant, but without knowing the expected number of applications, the success rate remains unknown.

Co-funding Requirement: The text does not explicitly mention a co-funding requirement.

Summary:

This is a call for proposals under the Digital Europe Programme (DIGITAL), specifically the DIGITAL-JU-CHIPS-2025-IA-LEAI call, which aims to drive the development of next-generation edge AI chips. The call is managed by the Chips Joint Undertaking (Chips JU). The primary goal is to fund projects that will develop AI chip prototypes, reaching Technology Readiness Levels 6-7, that combine high performance with ultra-low power consumption. These chips should enable real-time, on-chip AI capabilities for various applications, including mobile communication networks (6G), autonomous systems, industrial automation, and healthcare.

The call encourages the integration of cutting-edge technologies such as non-volatile memories, neuromorphic computing, 3D heterogeneous integration, and photonic connectivity. Projects should leverage state-of-the-art infrastructures within the European Union, including the Testing and Experimentation Facility (TEF) for Edge AI hardware (PREVAIL project) and Pilot Lines of the Chips for Europe Initiative.

The total budget for this call is €20,000,000, and it is expected that approximately 4 grants will be awarded, with each grant ranging from €1,000,000 to €5,000,000. The call follows a single-stage submission process, with the submission session opening on 08 July 2025 and closing on 17 September 2025.

Eligible applicants are expected to be organizations capable of developing AI chip prototypes and demonstrating their potential for industrial scaling. While the specific types of eligible applicants are not explicitly listed, the mention of RTOs, LEARs, and other entities suggests that research institutions, technology organizations, and companies with relevant expertise are likely to be eligible. Applicants are encouraged to consider forming consortia, as indicated by the partner search announcements.

The successful projects are expected to contribute to Europe's digital transformation and sustainability goals by advancing AI chips that are energy-efficient and highly secure. The call aims to foster innovation in edge AI technology and strengthen Europe's position in the global semiconductor industry.